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15 March 2002 Quantitative thermal nondestructive evaluation using an uncooled microbolometer infrared camera
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Abstract
Recent advances in uncooled microbolometer detector arrays has resulted in low cost, small size/weight, and low power consumption infrared cameras. The purpose of this paper is to assess the capabilities of the new microbolometer infrared cameras for quantitative thermal nondestructive evaluation. The camera assessed is a 160 x 128 uncooled microbolometer sensor array operating in the long wavelength infrared band (7.5 to 13.5 microns). The camera size is 4.32 H x 4.32 W X 10.92 L centimeters. Quantitative thermal diffusivity and thickness images obtained by minimizing the squared difference between the data and a thermal model on samples with fabricated defects are presented. The results are compared to conventional thermal imaging cameras using cooled focal plane array detectors. The advantages of a synchronized electronic shutter system (SESS) to remove the heat lamp influence during and after flash heating will also be discussed for these uncooled microbolometer detector arrays.
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Joseph N. Zalameda and William P. Winfree "Quantitative thermal nondestructive evaluation using an uncooled microbolometer infrared camera", Proc. SPIE 4710, Thermosense XXIV, (15 March 2002); https://doi.org/10.1117/12.459614
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