Advanced FPAs for multiple applications

Leonard P. Chen

doi:10.1117/12.478834

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5 August 2002 Advanced FPAs for multiple applications

Leonard P. Chen

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Proceedings Volume 4721, Infrared Detectors and Focal Plane Arrays VII; (2002) https://doi.org/10.1117/12.478834
Event: AeroSense 2002, 2002, Orlando, FL, United States

Abstract

The advantages and uses of infrared (IR) imaging continue to grow. As such, a new generation of requirements for IR focal plane arrays (IRFPAs) has emerged that affects the development of both the detectors and readout integrated circuits (ROICs). Because these applications have varying requirements, a universal set of FPAs cannot be made to satisfy all needs, and custom designs are needed. However, the desired capabilities follow a common theme. The industry is receiving more demands in the areas of larger formats, increased sensitivity, smaller pixels, and higher functionality. These must be met in addition to achieving production quantities at a low cost. This paper focuses on two main facets of the complex FPA, the detector and readout integrated circuit (ROIC), to address the evolving requirements. For detectors, we explore both the cooled and uncooled technologies, where HgCdTe grown by molecular beam epitaxy (MBE) and vanadium oxide (VOx) microbolometers are discussed, respectively, for the two areas. Development in ROICs expands in terms of smart features, on-chip signal processing, and on-chip analog-to-digital conversion.

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Leonard P. Chen "Advanced FPAs for multiple applications", Proc. SPIE 4721, Infrared Detectors and Focal Plane Arrays VII, (5 August 2002); https://doi.org/10.1117/12.478834

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