100-kV high-resolution e-beam lithography system: JBX-9300FS

Hitoshi Takemura; Hirofumi Ohki; Moriyuki Isobe

doi:10.1117/12.476925

1 August 2002 100-kV high-resolution e-beam lithography system: JBX-9300FS

Hitoshi Takemura, Hirofumi Ohki, Moriyuki Isobe

Author Affiliations +

Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.476925
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan

Abstract

Electron beam lithography system JBX-9300FS has the specifications of high-resolution exposure down to 20nm line width and also of accuracy of 20nm field stitching and 25nm overlay for alignment exposure on wafer. In this paper we will introduce 100kV high voltage gun design, new functions of hardware and software and recent results of evaluation data of the system. It is expected that the high precision lithography with high accelerating fine beam by JBX-9300FS will greatly contribute to the use of not only direct writing for the development of next generation devices and the production of optical or communication devices but also the development and prototype production of new masks for Next Generation Lithography tools, such as x-ray, EUV, EPL, and LEEPL.

Citation Download Citation

Hitoshi Takemura, Hirofumi Ohki, and Moriyuki Isobe "100-kV high-resolution e-beam lithography system: JBX-9300FS", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); https://doi.org/10.1117/12.476925

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