130-nm reticle inspection using multibeam UV-wavelength database inspection

Christopher M. Aquino; Robert Schlaffer

doi:10.1117/12.476963

1 August 2002 130-nm reticle inspection using multibeam UV-wavelength database inspection

Christopher M. Aquino, Robert Schlaffer

Author Affiliations +

Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.476963
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan

Abstract

The TeraStar family of reticle inspection systems were introduced in 2000 with die-to-die and STARlightT capability. These tools set the standard for high-resolution reticle inspection for the 130 nm design rule and below. The latest addition to the TeraStar family is the TeraStar SLF77, which extends the tool platform to include die-to-database inspection capability. Sensitivity for Chrome on Glass is 100 nm with much greater tolerance for inspecting aggressive OPC features such as serifs and assist lines. Many advanced reticles that are not inspectable on previous generation inspection tools are all inspectable on the TeraStar SLF77. Data prep times and file structure have been significantly improved with the average prep time being less than 10 percent of the 365UV-HR and average output file size less than 25 percent of the GigaPrep. The TeraStar SLF77 incorporates all the features of the TeraStar family such as triple-beam optics and TeraPro HP High Productivity Modes with the ability to run STARlight inspections concurrently with either die-to-die or die-to-database pattern inspections. Advanced registration algorithms accommodate subtle plate and machine errors to provide high sensitivity with low false detections. Advanced image overlay inspects small lines and OPC features and is very independent of defect shape and location. The TeraStar SLF77 has removed the barriers that existed with previous generation database inspection tools and made advanced reticle die-to-database inspection cost effective. Last October, KLA-Tencor introduced the TeraStar SLF77 and the three beta sites have recently completed beta evaluation. Here we present the first results from the use of the TeraStar in a production environment triple beam die-to-database inspection system. We have also shipped more than ten systems to customers worldwide. This paper describes the implementation of productivity improvements at the beta sites, performance on 130nm node customer product reticles, and KLA-Tencor's continued development on advanced inspection reticles.

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Christopher M. Aquino and Robert Schlaffer "130-nm reticle inspection using multibeam UV-wavelength database inspection", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); https://doi.org/10.1117/12.476963

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KEYWORDS

Inspection

Reticles

Databases

Image transmission

Metals

Calibration

Optical proximity correction

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