Processing techniques in the manufacture of 100-nm node and below inspection test reticles

Nicole Cheng; Clyde Su; Frank Chen; Bill Cheng; Darren Taylor

doi:10.1117/12.476965

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1 August 2002 Processing techniques in the manufacture of 100-nm node and below inspection test reticles

Nicole Cheng, Clyde Su, Frank Chen, Bill Cheng, Darren Taylor

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Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.476965
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan

Abstract

Manufacturing technology in the photomask process is critical for building devices of today's specifications. However, when building masks for equipment suppliers, it is necessary to provide capability at least two years in advance of current requirements. Of particular interest are masks used to characterize and benchmark inspection tools. This paper demonstrates and compares the mask processing capabilities of 50keV e-beam writing platforms in the effort to build a new inspection test mask pattern. Both standard and OPC patterns will be examined to understand the impact of each to the mask manufacturer. In addition to 50keV e- beam platforms, complementary high-end process and metrology tools will be utilized and reported.

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Nicole Cheng, Clyde Su, Frank Chen, Bill Cheng, and Darren Taylor "Processing techniques in the manufacture of 100-nm node and below inspection test reticles", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); https://doi.org/10.1117/12.476965

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