Simulation based defect printability analysis on attenuated phase-shifting masks

Linyong Pang; Qi-De Qian; Kevin K. Chan; Nobuhito Toyama; Naoya Hayashi

doi:10.1117/12.476979

1 August 2002 Simulation-based defect printability analysis on attenuated phase-shifting masks

Linyong Pang, Qi-De Qian, Kevin K. Chan, Nobuhito Toyama, Naoya Hayashi

Author Affiliations +

Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.476979
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan

Abstract

Simulated wafer images for Attenuated Phase Shift Mask (ATTPSM) features are performed by the Virtual Stepper System. The ATTPSM test reticles were prepared with programmed defects (hard defects and phase defects) on line/space patterns, contact hole patterns, and rectangle patterns for 150-nm design rules. Each defect area was inspected using KLA-Tencor's UV-HR365 and SLF27 inspection systems. Virtual Stepper simulations are compared with Aerial Image Measurement System (AIMSTM) simulation at best focus and at multiple defocus levels. In addition, simulation accuracy from different inspection images is compared.

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Linyong Pang, Qi-De Qian, Kevin K. Chan, Nobuhito Toyama, and Naoya Hayashi "Simulation-based defect printability analysis on attenuated phase-shifting masks", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); https://doi.org/10.1117/12.476979

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