Strength and long-term reliability testing of wafer-bonded MEMS

Matthias Petzold; Dieter Katzer; M. Wiemer; Joerg Bagdahn

doi:10.1117/12.462863

19 April 2002 Strength and long-term reliability testing of wafer-bonded MEMS

Matthias Petzold, Dieter Katzer, M. Wiemer, Joerg Bagdahn

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462863
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

Waferbonding techniques are frequently used for MEMS/MOEMS fabrication. In this paper, the potential application and methodical limitations of different strength testing approaches including tensile testing and double-cantilever- beam testing for wafer-bonded components are investigated. Special attention is given to the influence of the interfacial atomic bonding strength, the role of interface voids and notches caused by chemical or physical etching steps prior to bonding on the fracture limit. A particular aim of the paper is to discuss the potential of the Micro Chevron-Test for the assessment of the wafer bonding process with particular respect to the quality control during MEMS fabrication. In addition, the methods can also be applied to investigate the lifetime and fatigue properties of wafer- bonded samples exposed to constant or cyclic stresses.

Citation Download Citation

Matthias Petzold, Dieter Katzer, M. Wiemer, and Joerg Bagdahn "Strength and long-term reliability testing of wafer-bonded MEMS", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462863

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