CD performance of CA-resits with dynamically controlled multi-zone bake system

Shiho Sasaki; Masa-aki Kurihara; Hiroshi Mohri; Naoya Hayashi; Peter Dress; Andreas Noering; Thomas M. Gairing

doi:10.1117/12.479343

16 August 2002 CD performance of CA-resits with dynamically controlled multizone bake system

Shiho Sasaki, Masa-aki Kurihara, Hiroshi Mohri, Naoya Hayashi, Peter Dress, Andreas Noering, Thomas M. Gairing

Proceedings Volume 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2002) https://doi.org/10.1117/12.479343
Event: 18th European Mask Conference on Mask Technology for Integrated Circuits and Micro-Components, 2002, Munich-Unterhaching, Germany

Abstract

CD-uniformity data of chemically amplified (CA) resists have been generated, by using a dynamically controlled multi-zone hotplate system, APB5000. The optimized baking procedure of the APB5000 system for Post Coat Bake (PCB) and Post Exposure Bake (PEB) is characterized by a maximum in the total temperature range on a 6025 mask substrate surface of 0.5 degree(s)C during the heat-up ramping and smaller than 0.2 degree(s)C at the set-point temperature of 90 degree(s)C. In this experiment CD-uniformity for isolated lines was improved to 7.8nm, compared to 13nm when using conventional baking systems. Additionally, a compensation method based on the baking processes is presented to further decrease the CD- uniformity range of CA-resists. Derived from CD-uniformity data measurements, a local temperature variation from the optimized baking strategy of the APB5000 system is used to compensate CD-errors caused by other process steps. In this experiment the result of such a measure showed a 40% improvement of the CD-uniformity range for dense lines from 14.2nm to 8.0nm.

Citation Download Citation

Shiho Sasaki, Masa-aki Kurihara, Hiroshi Mohri, Naoya Hayashi, Peter Dress, Andreas Noering, and Thomas M. Gairing "CD performance of CA-resits with dynamically controlled multizone bake system", Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); https://doi.org/10.1117/12.479343

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