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23 January 2003 Low power system-on-chip FPAs
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Abstract
Rockwell Scientific's 3rd generation FPAs and sensor chip assemblies (SCA) are complete imaging systems-on-chip for IR and visible cameras. They provide 12-bit to 16-bit digital video at very low power consumption in hybrid and monolithic configurations. A 1936 by 1088 i-SoC with 5μm pixel pitch performs stand-alone visible imaging and a related application-specific integrated circuit supports SCAs. The former generates high-definition video at 30 Hz with <30 e-read noise, -80 dB fixed pattern noise and up to 70dB dynamic range at standard 2/3 inch optical format. When coupled to a fiber optic faceplate with micro-channel plate, the i-SoC for HDTV is believed the first for low-light-level HDTV imaging with 12-bit output at <200 mW. The latter, currently being developed to revolutionize space-and ground-based astronomy, is optimized for HAWAII-2RG 2048×2048 FPAs to provide 16-bit video at approximately 10mW for 10 Mbps imaging. The ASIC will help build very large mosaics for next-generation telescope sensors.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lester J. Kozlowski, M. Loose, Atul B. Joshi, Kadri Vural, and Michael P. Buchin "Low power system-on-chip FPAs", Proc. SPIE 4820, Infrared Technology and Applications XXVIII, (23 January 2003); https://doi.org/10.1117/12.453565
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