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19 November 2003 New technique for Si-based microphotonic components fabrication
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Proceedings Volume 4829, 19th Congress of the International Commission for Optics: Optics for the Quality of Life; (2003) https://doi.org/10.1117/12.527074
Event: 19th Congress of the International Commission for Optics: Optics for the Quality of Life, 2002, Florence, Italy
Abstract
This paper presents the experiments we have performed to obtain microphotonic components using a new technique: the anisotropic wet etching of Si <111>-oriented wafers. The anisotropic etching was combined with an isotropic pre-etch step, followed or not by sidewall passivation. The influence of the mask orientation and layout on the shape and size of the etched cavity was studied and then the masks and the technological process for fabrication of S3N4/SiO2 and c-Si freestanding structures were established. Movable Si3N4 micromirrors, SiO2 or c-Si waveguides were obtained using a low-cost technological process. These components can be further integrated with optoelectronic devices on a silicon substrate.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dana Cristea and Elena Manea "New technique for Si-based microphotonic components fabrication", Proc. SPIE 4829, 19th Congress of the International Commission for Optics: Optics for the Quality of Life, (19 November 2003); https://doi.org/10.1117/12.527074
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