Thermal reliability studies of optoelectronic components

Padraig J. Hughes; Ger Healy; Xavier Llinares; Mahbub Akhter; J. Justice; Shane O'Brien; John A. Alderman; Gabriel M. Crean

doi:10.1117/12.476005

27 August 2003 Performance and reliability studies of optoelectronic components for telecommunications

Padraig J. Hughes, Ger Healy, Xavier Llinares, Mahbub Akhter, J. Justice, Shane O'Brien, John A. Alderman, Gabriel M. Crean

Author Affiliations +

Proceedings Volume 4876, Opto-Ireland 2002: Optics and Photonics Technologies and Applications; (2003) https://doi.org/10.1117/12.476005
Event: OPTO Ireland, 2002, Galway, Ireland

Abstract

For optical networks, the operating life of optoelectronic components is expected to be over 20 years. Network designers therefore require components, which have been reliability tested in accordance with assured protocols, such as Telcordia Generic Reliability Assurance Practices (BellCore). In this paper, we report on the development of a system for thermal reliability studies of optoelectronic devices. The system incorporates an environmental test chamber programmed to provide differing temperature environments in the range (-180° to 300° C) as well as constant bias current or voltage to the device udner test. Case studies for preliminary screenign and temperature cycling tests on a wide range of novel active and passive devices fabricated at NMRC for short-haul networks markets are assessed and reported using this system.

Citation Download Citation

Padraig J. Hughes, Ger Healy, Xavier Llinares, Mahbub Akhter, J. Justice, Shane O'Brien, John A. Alderman, and Gabriel M. Crean "Performance and reliability studies of optoelectronic components for telecommunications", Proc. SPIE 4876, Opto-Ireland 2002: Optics and Photonics Technologies and Applications, (27 August 2003); https://doi.org/10.1117/12.476005

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