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10 September 2002 Microstructures of PMMA sheet fabricated by RIE
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The reactive ion etching (RIE) of commercial PMMA sheet has been examined in pure 02 and CHF3/02 plasma. The aim of this study was to optimize the etching PMMA process parameter. Addition of CHF3 , which have a surface passivation effect, to Oxygen plasmas should be obtained vertical edges at an acceptable etch rate. A RIE parallel plate reactor was used and electroplated nickel film was used as mask. We discuss the influence of pure 02 and O2/CHF3 etching gas on etching profile, the influence of the etching parameters such as gas pressure and CHF3/O2 ratio on vertical etching rate, lateral etching rate and etching profile was also investigated.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Longwang Huang, Chunsheng Yang, and Guifu Ding "Microstructures of PMMA sheet fabricated by RIE", Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002);


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