Development of a micro hot embossing process for fabricating micro optical devices

Xue Chuan Shan; Ryutaro Maeda; Yoichi Murakoshi

doi:10.1117/12.469430

13 November 2002 Development of a micro hot embossing process for fabricating micro-optical devices

Xue Chuan Shan, Ryutaro Maeda, Yoichi Murakoshi

Proceedings Volume 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems; (2002) https://doi.org/10.1117/12.469430
Event: SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, 2002, Melbourne, Australia

Abstract

A micro hot embossing process has been developed for low cost and mass-production fabrications of optical switching components. After illustrating the architecture design and mold fabrication of a proposed optical switch, this paper describes the optimizations of parameters for hot embossing process to manufacture components of the optical switch. Polycarbonate has been used as the process material. The height of embossed mirrors, the thickness of actuating cantilever and the deformation of switch platforms have been measured precisely. The influence of process parameters has been investigated, and the optimized process parameters have been recommended with the process temperature and loading force being around 180°C and 1500Kg, respectively. The design guideline of nickel mold for easier release after embossing has also been recommended. The experimental results have demonstrated technological feasibility of micro hot embossing for low cost and mass-production of micro optical devices.

Citation Download Citation

Xue Chuan Shan, Ryutaro Maeda, and Yoichi Murakoshi "Development of a micro hot embossing process for fabricating micro-optical devices", Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); https://doi.org/10.1117/12.469430

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