Paper
13 November 2002 Micromachined magnetometer-accelerometer for a navigation system
Ji-Man Cho, Kyung Soo Kim, Seungdo An, HoJoon Park, Ghun Hahm
Author Affiliations +
Proceedings Volume 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems; (2002) https://doi.org/10.1117/12.469429
Event: SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, 2002, Melbourne, Australia
Abstract
A new type of magnetometer-accelerometer is developed with a silicon micromachining. The operation principle of the sensor is based on the well known Lorentz force caused by the interaction of a current and an external magnetic field on a suspended conducting beam. To realize a new resonant micro sensor detecting both acceleration and the geomagnetic field simultaneously, a conducting line is formed on a spring part of a silicon accelerometer having two mass plates. And a new Samsung MEMS fabrication process is developed for this sensor. The process uses a silicon-on-glass (SOG) wafer, an inverted SOG wafer, and a gold-silicon eutectic bonding for the wafer-level hermetic packaging. To operate the sensor, an ac current of its mechanical resonant frequency is driven through the conducting line. Totally 1 mW is consumed in the current driving element. This newly developed sensor is enough for the 10 degree electronic display of the orientation angle and can be used in a portable navigator such as SmartPhones and PDAs that need a small, low cost and low power electronic compass.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ji-Man Cho, Kyung Soo Kim, Seungdo An, HoJoon Park, and Ghun Hahm "Micromachined magnetometer-accelerometer for a navigation system", Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); https://doi.org/10.1117/12.469429
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Cited by 3 scholarly publications.
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KEYWORDS
Magnetism

Sensors

Semiconducting wafers

Silicon

Magnetic sensors

Wafer bonding

Gold

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