F2-laser applications for machining optoelectronic microstructures

Peter E. Dyer; Anne-Marie Johnson; Saher M. Maswadi; Christopher D. Walton

doi:10.1117/12.468388

15 April 2003 F₂-laser applications for machining optoelectronic microstructures

Peter E. Dyer, Anne-Marie Johnson, Saher M. Maswadi, Christopher D. Walton

Proceedings Volume 4941, Laser Micromachining for Optoelectronic Device Fabrication; (2003) https://doi.org/10.1117/12.468388
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium

Abstract

We report studies of material processing using the VUV F₂ laser which, by virtue of its low threshold, high resolution 'machining' capability, may bring advantage to laser-based optoelectronic and photonic device fabrication. For example, probe beam deflection and etch rate studies of polymethylmethacrylate (PMMA) show this has a low ablation threshold, F_T=20mJcm^-2, and a large effective absorption coefficient, 1.6 x 10⁵ cm^-1, at 157nm, permitting high-resolution etching at modest fluence. The smooth ablated surfaces and low degree of thermal damage obtained with this laser make it well suited to machining structures such as relief gratings in PMMA. We also describe new results on producing fiber Bragg gratings with the 157nm laser. It is shown that these gratings can be written in a non-sensitized single mode fiber (Corning HI 980) with a low fluence and low total dose.

Citation Download Citation

Peter E. Dyer, Anne-Marie Johnson, Saher M. Maswadi, and Christopher D. Walton "F₂-laser applications for machining optoelectronic microstructures", Proc. SPIE 4941, Laser Micromachining for Optoelectronic Device Fabrication, (15 April 2003); https://doi.org/10.1117/12.468388

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