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15 April 2003 Fabricating VCSELs in a high-tech start-up
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Proceedings Volume 4942, VCSELs and Optical Interconnects; (2003) https://doi.org/10.1117/12.476220
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium
Abstract
U-L-M photonics GmbH has been set up to develop next-generation vertical-cavity surface-emitting laser (VCSEL) products and to exploit the full potential of these industry-leading devices in terms of performance and application areas. Reliability is important for all application areas for VCSELs. This paper presents the excellent reliability characteristics of U-L-M’s VCSEL technology. Accumulation of all advantageous properties VCSELs are famous for, like low power consumption, circular low divergent beam profile, high modulation bandwidth, and scalability of monolithic arrangements, results in two-dimensional (2D) VCSEL arrays that appear as key components to reach highest aggregate bandwidths of tomorrow’s parallel optical transceivers. We report on 2D VCSEL arrays, substrate emitting although operating at 850 nm and prepared for flip-chip bonding, that are well suited for the customer’s needs in terms of speed, power consumption, and compact integration. Up to now, in most single channel transceivers, the VCSEL is packaged in a TO can and connected to the driver via a printed circuit board. We investigate the performance of a high speed VCSEL in a TO 46 package and demonstrate 10 Gbps transmission. The potential of VCSEL technology in other areas of application than datacom or telecom is just going to be exploited. We present a 760 nm single-mode VCSELs for gas monitoring applications.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Martin Grabherr, Roland Jaeger, Roger King, Burghard Schneider, and Dieter Wiedenmann "Fabricating VCSELs in a high-tech start-up", Proc. SPIE 4942, VCSELs and Optical Interconnects, (15 April 2003); https://doi.org/10.1117/12.476220
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