Paper
19 June 2003 Ultrafast pulse train micromachining
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Abstract
A new micromachining technique using user-defined trains of amplified femtosecond laser pulses is described. In this method, a 2-fold Michelson interferometer is used to split each output pulse of an amplified femtosecond laser system operating at 1 kHz into four different pulses at desired seperations ranging from 1 ps to 1 ns. These quadruple pulses are then focused on metal, semiconductor and dielectric samples and the material removal characteristics are noted. The experimental results show that there is a distinct effect of the pulse separation on the machining characteristics. It is observed that, in some cases, use of the quadruple pulses separated by 1 ns provides better material removal than the original pulses separated by 1 ms. The femtosecond laser-material interaction is also modeled for the case of metal samples using the two-temperature model. Numerical simulations that were carried out show that irradiation with quadruple pulses lead to a reduction in the predicted melting threshold fluence, which agrees with the experimental observation.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ihtesham H. Chowdhury, Xianfan Xu, and Andrew M. Weiner "Ultrafast pulse train micromachining", Proc. SPIE 4978, Commercial and Biomedical Applications of Ultrafast Lasers III, (19 June 2003); https://doi.org/10.1117/12.478585
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Cited by 18 scholarly publications.
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KEYWORDS
Femtosecond phenomena

Metals

Tellurium

Thallium

Silicon

Micromachining

Picosecond phenomena

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