Direct thin film imaging (DTFI) based on PMOD (photochemical metal-organic deposition) methodology

Harold O. Madsen; Seigi Suh; Leo G. Svendsen; Shyama P. Mukherjee; Paul J. Roman Jr.; Michael A. Fury; Katy Ip

doi:10.1117/12.478292

15 January 2003 Direct thin-film imaging, DTFI, based on PMOD (photochemical metal-organic deposition) methodology

Harold O. Madsen, Seigi Suh, Leo G. Svendsen, Shyama P. Mukherjee, Paul J. Roman Jr., Michael A. Fury, Katy Ip

Proceedings Volume 4979, Micromachining and Microfabrication Process Technology VIII; (2003) https://doi.org/10.1117/12.478292
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

Considerable difficulties and limitations are associated with the patterning of thick photoresist layers to generate high aspect ratio features in MEMS fabrication. Moreover, a large number of steps is needed to achieve the patterned MEMS structures. The PMOD methodology takes advantage of direct patterning of a photoimageable, highly etch resistant inorganic metal oxide precursor to form the hard mask. A spin coated thin TiO₂ film deposited onto a Novolac transfer layer has been evaluated. An etch ratio of 850:1 between Novolac resin and TiO₂ thin-film has been achieved by oxygen gas RIE. One set of process parameters demonstrated vertical sidewalls on 10 m thick Novolac using a 20 nm patterned TiO₂ thin-film. Photo resolution of the TiO₂ films as small as 0.5 m has been demonstrated using a contact aligner. In addition to applying our process to silicon substrates, we have also demonstrated the feasibility of patterning on ceramic alumina substrates. The plasma-etch residues and the PMOD film were removed by wet chemical cleaning solutions developed at EKC Technology.

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Harold O. Madsen, Seigi Suh, Leo G. Svendsen, Shyama P. Mukherjee, Paul J. Roman Jr., Michael A. Fury, and Katy Ip "Direct thin-film imaging, DTFI, based on PMOD (photochemical metal-organic deposition) methodology", Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); https://doi.org/10.1117/12.478292

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KEYWORDS

Etching

Photoresist materials

Photomasks

Thin films

Microelectromechanical systems

Optical lithography

Silicon

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