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15 January 2003 Novel micromolded structures
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Proceedings Volume 4979, Micromachining and Microfabrication Process Technology VIII; (2003) https://doi.org/10.1117/12.478243
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Abstract
Current deep trench etch systems are able to etch two micron wide features ten’s of microns deep into a silicon substrate. Conformal chemical vapor deposition (CVD) processes are readily able to fill the trenches with reasonable deposition thickness by growing from the sidewalls in. We have used this approach to demonstrate 30 micron thick tungsten structural members integrated with 30 micron thick silicon nitride electrical isolation. The moving tungsten and silicon nitride structures are suspended 15 microns off the surface of the substrate by silicon nitride posts. Planarity is maintained throughout the process.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James G. Fleming, Seethambal S. Mani, and Michael S. Baker "Novel micromolded structures", Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); https://doi.org/10.1117/12.478243
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