Performance enhancement and evaluation of deep dry etching on a production cluster platform

Mark E. McNie; Christopher Pickering; Alexandra L. Rickard; Iain M. Young; Janet Hopkins; Huma Ashraf; Serrita A. McAuley; Glenn Nicholls; Richard Barnett; Fred Roozeboom; Anton Kemmeren; Eric Van Den Heuvel; Jan T. Verhoeven; Colin Gormley; Paulo Schina; Corrado Di Luciano; Jyrki Kiihamaki

doi:10.1117/12.478242

15 January 2003 Performance enhancement and evaluation of deep dry etching on a production cluster platform

Mark E. McNie, Christopher Pickering, Alexandra L. Rickard, Iain M. Young, Janet Hopkins, Huma Ashraf, Serrita A. McAuley, Glenn Nicholls, Richard Barnett, Fred Roozeboom, Anton Kemmeren, Eric Van Den Heuvel, Jan T. Verhoeven, Colin Gormley, Paulo Schina, Corrado Di Luciano, Jyrki Kiihamaki

Author Affiliations +

Proceedings Volume 4979, Micromachining and Microfabrication Process Technology VIII; (2003) https://doi.org/10.1117/12.478242
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

Over the last 5 years, deep dry etching of silicon has developed into a mainstream microsystems process technology. To transition from R&D into production, some of the main issues to address are the CoO (cost of ownership), reliability and reproducibility of capital equipment. Commensurate with this, it is essential to achieve high etch rates with good profile control. MICROSPECT (Microsystems Production Evaluated Cluster Tool), a project within the EC SEA programme, has sought to address these issues. The project has evaluated and significantly enhanced the performance of STS ASE modules for deep dry etching on an ASPECT^HR production cluster platform. The development phase of the project has provided an ideal opportunity for the equipment supplier to test and respond to feedback on the tool and the latest hardware and software developments with multiple end users, including a new high density inductively coupled plasma (ICP) source. This has resulted in higher etch rates for greater throughput and improved profile control across a variety of applications, including silicon-on-insulator (SOI)-based MEMS and microfluidics. During the evaluation phase, the system was operated under close-to-production conditions to establish system reliability and metrics.

Citation Download Citation

Mark E. McNie, Christopher Pickering, Alexandra L. Rickard, Iain M. Young, Janet Hopkins, Huma Ashraf, Serrita A. McAuley, Glenn Nicholls, Richard Barnett, Fred Roozeboom, Anton Kemmeren, Eric Van Den Heuvel, Jan T. Verhoeven, Colin Gormley, Paulo Schina, Corrado Di Luciano, and Jyrki Kiihamaki "Performance enhancement and evaluation of deep dry etching on a production cluster platform", Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); https://doi.org/10.1117/12.478242

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available