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16 January 2003 Burn-in test reduction for the Digital Micromirror Device (DMD)
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Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.478211
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Abstract
Burn-in test has long been used in the semiconductor industry to screen out manufacturing defects. MEMS technologies, such as the DMD, can also use burn-in test to eliminate infant mortality failures. Burn-in test and test systems are among the most costly however, and it is always under review to shorten time or increase efficiency without reducing effectiveness. Detailed failure mode analysis from many thousands of device test logs resulted in the development of a novel application of an observed stress factor. Burn-in test time was reduced 55% on high volume DMD products with increased test efficiency and effectiveness.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Timothy J. Hogan, Paul Barker, and Michael R. Douglass "Burn-in test reduction for the Digital Micromirror Device (DMD)", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); https://doi.org/10.1117/12.478211
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