Fracture toughness study on LIGA fabricated microstructures

Catherine Oropeza; Kun Lian; Wanjun Wang

doi:10.1117/12.478209

16 January 2003 Fracture toughness study on LIGA fabricated microstructures

Catherine Oropeza, Kun Lian, Wanjun Wang

Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.478209
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

One of the major difficulties faced by MEMS researchers today is the lack of data regarding properties of electroplated metals or alloys at micro-levels as those produced by the LIGA and the LIGA related process. These mechanical properties are not well known and they cannot be extrapolated from macro-scale data without experimental verification. This lack of technical information about physical properties at microscale has affected the consistency and reliability of batch-fabricated components and leads to very low rates of successful fabrication. Therefore, this material issue is of vital importance to the development of LIGA technology and to its industrial applications. The research work reported in this paper focuses on the development of a new capability based on design, fabrication, and testing of groups of UV-LIGA fabricated nickel microspecimens for the evaluation of fracture strength. The devised testing mechanism demonstrated compatibility with the fabricated samples and capability of performing the desired experimentation by generating resistance-to-fracture values of the nickel specimens. The average fracture strength value obtained, expressed with a 95% confidence interval, was 315 ± 54 Mpa. Further data acquisition, especially involving tensile specimen testing, and material analysis is needed to fully understand the implications of the information obtained.

Citation Download Citation

Catherine Oropeza, Kun Lian, and Wanjun Wang "Fracture toughness study on LIGA fabricated microstructures", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); https://doi.org/10.1117/12.478209

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