Solder bonding for microelectromechanical systems (MEMS) applications

Abhijat Goyal; Srinivas Tadigadapa; Rafiqul Islam

doi:10.1117/12.478202

16 January 2003 Solder bonding for microelectricalmechanical systems (MEMS) applications

Abhijat Goyal, Srinivas Tadigadapa, Rafiqul Islam

Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.478202
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

MEMS fabrication and packaging requires a bonding technology that is universal for all substrates, has high resolution, requires relatively lower temperatures, is reliable and is low cost to implement. The bonding technology presented meets the above standards. The process is substrate independent and involves aligned bonding of two similarly patterned wafers using tin solder as the bonding material. The technique can be used for whole wafer or selected area bonding. The resolution of this technique is only limited by the resolution that can be achieved in the patterning and delineation of the seed metal.

Citation Download Citation

Abhijat Goyal, Srinivas Tadigadapa, and Rafiqul Islam "Solder bonding for microelectricalmechanical systems (MEMS) applications", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); https://doi.org/10.1117/12.478202

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available