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21 January 2003 MOEMS device design, development, and integration for interconnect applications
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Proceedings Volume 4983, MOEMS and Miniaturized Systems III; (2003)
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Despite the recent sag in the optical telecom sector, the development and application of Micro-Opto-Electro-Mechanical Systems (MOEMS)-based devices for optical interconnects continues to expand. The utility of such fundamental research is finding increasing relevance in a variety of technical and commercial areas. This paper will report on the present status of the diffractive and reflective components and arrays that are being developed at the University at Albany’s Institute for Materials (UAIM) NanoFab 200. Selected examples include the current generation of the patented MEMS Compound Grating (MCG) and an innovative micro-scanner device, both of which are being examined for inclusion in prototype interconnect systems. These devices are based on a dual technology development path which includes decreasing feature size and increasing integration level. The MCG prototypes are currently produced with 1-2 micron feature size in 144 element arrays. The surface topology of these components can be controlled using electrostatic attraction to yield both angular deflection and wavelength separation. The optical and mechanical performance of these devices that use either polysilicon or silicon dioxide as a structural material will be reported. Several prototype MCG array architectures have been interfaced with optical sources including VCSEL arrays to test optical interconnect concepts. In addition, recent work on an innovative micro-scanner will be discussed. The micro-scanner is based on a cantilever design with access electrodes to electrostatically control deflection in multiple planes. Details of the components including simulation, fabrication and initial prototype performance tests will be presented.
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James Castracane, Bai Xu, Seth Madison, Jaap Verheggen, and Dong Yan "MOEMS device design, development, and integration for interconnect applications", Proc. SPIE 4983, MOEMS and Miniaturized Systems III, (21 January 2003);

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