Direct writing of 40-nm features inside fused silica glass with oscillator ultrafast lasers

Sheng Wu; Zhaozhi Wan

doi:10.1117/12.477832

17 January 2003 Direct writing of 40-nm features inside fused silica glass with oscillator ultrafast lasers

Sheng Wu, Zhaozhi Wan

Proceedings Volume 4984, Micromachining Technology for Micro-Optics and Nano-Optics; (2003) https://doi.org/10.1117/12.477832
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

With ultra-fast oscillator lasers (less than 1nJ/pulse, 80MHz repetition rate), we propose that we could fabricate features with less than 40nm inside UV transparent material such as fused silica and quartz. The low threshold property of this demonstration could lower the cost of lasers, and improve the throughput of laser machining due to the quasi-CW nature of the laser used. Our initial results shows that damages are observed with threshold as low as 1nJ before the UV objective, and then size is below 1 micron.

Citation Download Citation

Sheng Wu and Zhaozhi Wan "Direct writing of 40-nm features inside fused silica glass with oscillator ultrafast lasers", Proc. SPIE 4984, Micromachining Technology for Micro-Optics and Nano-Optics, (17 January 2003); https://doi.org/10.1117/12.477832

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