Simulation and testing of an optical interconnection system using fiber image guides

Sunkwang Hong; Alexander A. Sawchuk

doi:10.1117/12.478316

19 June 2003 Simulation and testing of an optical interconnection system using fiber image guides

Sunkwang Hong, Alexander A. Sawchuk

Proceedings Volume 4987, Integrated Optics: Devices, Materials, and Technologies VII; (2003) https://doi.org/10.1117/12.478316
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States

Abstract

We describe the design, simulation and testing of an optoelectronic interconnection system that uses fiber image guides (FIGs) to transfer optical data packets among network nodes having both optical and electrical input-output (I/O) ports. FIGs are a tightly packed array of thousands of optical fibers, and are capable of 2D parallel image transmission with more flexible alignment and packaging than free-space alternatives. We have designed printed circuit boards (PCBs) for the system demonstration. The PCB has optoelectronic components such as: vertical cavity surface emitting lasers (VCSELs) and metal-semiconductor-metal (MSM) detector arrays for optical I/O, and transimpedance amplifier receiver (TIAR) arrays for converting photodetected current signals into 2.5V CMOS compatible signals. Using FIGs our system demonstrates high data transmission rates over 16 channels with low crosstalk. We discuss various techniques for coupling the FIGs to the optical I/O array and optimizing the coupling distance for low crosstalk and insertion loss. We also present 3D waveguide propagation simulations of FIGs based on the beam propagation method and compare the results with experiments. Both experiment and simulation show that the coupling distance and alignment are critical to achieve the best output optical power profile.

Citation Download Citation

Sunkwang Hong and Alexander A. Sawchuk "Simulation and testing of an optical interconnection system using fiber image guides", Proc. SPIE 4987, Integrated Optics: Devices, Materials, and Technologies VII, (19 June 2003); https://doi.org/10.1117/12.478316

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