Fluorinated polyimide film replicated using SiO2 mold for fabrication of waveguide

Tsuyoshi Shioda

doi:10.1117/12.475450

14 July 2003 Fluorinated polyimide film replicated using SiO₂ mold for fabrication of waveguide

Tsuyoshi Shioda

Proceedings Volume 4991, Organic Photonic Materials and Devices V; (2003) https://doi.org/10.1117/12.475450
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States

Abstract

A replication process using a SiO₂ mold was demonstrated using a fluorinated polyimide. The replicated fluorinated polyimide film was separated from the mold by soaking in distilled water. The film separation with slow and then successive fast steps was due to the displacment of the weak adhesive layer by water and release of stress at the interface, respectively. Lowering the curing temperature of the fluorinated polyimide, whcih formed the weak adhesive layer at the interface, improved separation without chipping of the stripes of the SiO₂ mold.

Citation Download Citation

Tsuyoshi Shioda "Fluorinated polyimide film replicated using SiO₂ mold for fabrication of waveguide", Proc. SPIE 4991, Organic Photonic Materials and Devices V, (14 July 2003); https://doi.org/10.1117/12.475450

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available