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30 May 2003 High-precision die bonding for photonics packaging
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Proceedings Volume 4997, Photonics Packaging and Integration III; (2003)
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States
Photonics packaging applications require significantly higher precision die bonding processes than traditional electronics and RF/microwave devices. Die placement accuracy of microns and better has been demonstrated. Key factors affecting the capability ofplacing die at accuracies of 5microns in photonics packaging are discussed. Factors that enable high accuracy die bonding range from machine platform design to a combination ofprocess parameters. Another key factor in die bonding placement accuracy is the quality of visual reference points or fiducials on the die, substrate, or surrounding package. Examples ofgood and poor visual references are shown and a discussion ofdie and package design is presented. A method ofplacement accuracy validation and a discussion ofhigh accuracy die bonding applications are presented.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott Trask, Khushwant Singh, Daniel F. Crowley, and Peter Cronin "High-precision die bonding for photonics packaging", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003);

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