High-precision die bonding for photonics packaging

Scott Trask; Khushwant Singh; Daniel F. Crowley; Peter Cronin

doi:10.1117/12.475483

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30 May 2003 High-precision die bonding for photonics packaging

Scott Trask, Khushwant Singh, Daniel F. Crowley, Peter Cronin

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Proceedings Volume 4997, Photonics Packaging and Integration III; (2003) https://doi.org/10.1117/12.475483
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States

Abstract

Photonics packaging applications require significantly higher precision die bonding processes than traditional electronics and RF/microwave devices. Die placement accuracy of microns and better has been demonstrated. Key factors affecting the capability ofplacing die at accuracies of 5microns in photonics packaging are discussed. Factors that enable high accuracy die bonding range from machine platform design to a combination ofprocess parameters. Another key factor in die bonding placement accuracy is the quality of visual reference points or fiducials on the die, substrate, or surrounding package. Examples ofgood and poor visual references are shown and a discussion ofdie and package design is presented. A method ofplacement accuracy validation and a discussion ofhigh accuracy die bonding applications are presented.

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Scott Trask, Khushwant Singh, Daniel F. Crowley, and Peter Cronin "High-precision die bonding for photonics packaging", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); https://doi.org/10.1117/12.475483

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