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30 May 2003 New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards
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Proceedings Volume 4997, Photonics Packaging and Integration III; (2003) https://doi.org/10.1117/12.475472
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States
Abstract
We demonstrated a new architecture of the optical interconnection system which can be applied in the waveguide-embedded optical printed circuit board (PCB). We used 45° ended optical connection rods as a medium to guide light paths perpendicularly between surface-emitting lasers (or photodiode) and waveguides. A polymer film of multimode waveguides with cores of 100μm x 65μm was sandwiched between conventional PCBs. We made through-holes with a diameter of ~140μm on the PCB, passing through the waveguide cores, using Ti-sapphire laser drill. The optical rods were made of the segment of multimode silica fiber ribbon. One end of the fiber segment was cut with 45° and the other end with 90° by using the high power laser cutting technique. These fiber rods were inserted into the through-holes formed in the PCB, adjusting the insertion depth to locate the 45°-end of rods near the waveguide core. From this interconnection system, we achieved 12channels optical transmission link through a waveguide with a channel pitch of 250μm in the optical PCB. This new interconnection structure using the optical connection rods is well compatible with the fabrication processes of conventional electronic PCB which is employing the through-hole formation by laser drill and the lamination of plastic films by compression.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Byung Sup Rho, Han Seo Cho, Ji-Young Eo, Saekyoung Kang, Hyo-Hoon Park, Young Woo Kim, Young Sang Joe, and Dok Jin Yang "New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); https://doi.org/10.1117/12.475472
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