Overlay considerations for 300-mm lithography

Tobias Mono; Uwe Paul Schroeder; Dieter Nees; Katrin Palitzsch; Wolfram Koestler; Jens Bruch; Sirko Kramp; Markus Veldkamp; Ralf Schuster

doi:10.1117/12.485019

2 June 2003 Overlay considerations for 300-mm lithography

Tobias Mono, Uwe Paul Schroeder, Dieter Nees, Katrin Palitzsch, Wolfram Koestler, Jens Bruch, Sirko Kramp, Markus Veldkamp, Ralf Schuster

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Proceedings Volume 5038, Metrology, Inspection, and Process Control for Microlithography XVII; (2003) https://doi.org/10.1117/12.485019
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

Generally, the potential impact of systematical overlay errors on 300mm wafers is much larger than on 200mm wafers. Process problems which are merely identified as minor edge yield detractors on 200mm wafers, can evolve as major roadblocks for 300mm lithography. Therefore, it is commonly believed that achieving product overlay specifications on 300mm wafers is much more difficult than on 200mm wafers. Based on recent results on high volume 300mm DRAM manufacturing, it is shown that in reality this assumption does not hold. By optimizing the process, overlay results can be achieved which are comparable to the 200mm reference process. However, the influence of non-lithographic processes on the overlay performance becomes much more critical. Based on examples for specific overlay signatures, the influence of several processes on the overlay characteristics of 300mm wafers is demonstrated. Thus, process setup and process changes need to be analyzed monitored much more carefully. Any process variations affecting wafer related overlay have to be observed carefully. Fast reaction times are critical to avoid major yield loss. As the semiconductor industry converts to 300mm technology, lithographers have to focus more than ever on process integration aspects.

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Tobias Mono, Uwe Paul Schroeder, Dieter Nees, Katrin Palitzsch, Wolfram Koestler, Jens Bruch, Sirko Kramp, Markus Veldkamp, and Ralf Schuster "Overlay considerations for 300-mm lithography", Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); https://doi.org/10.1117/12.485019

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