Void elimination research in bottom antireflective coatings for dual damascene photolithography

Kelly A. Nowak

doi:10.1117/12.483737

12 June 2003 Void elimination research in bottom antireflective coatings for dual damascene photolithography

Kelly A. Nowak

Proceedings Volume 5039, Advances in Resist Technology and Processing XX; (2003) https://doi.org/10.1117/12.483737
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

This paper describes the research completed to qualify materials to be used as bottom anti-reflective coatings (BARCs) for dual damascene (DD) photolithography. Several problems have been identified in the DD process. Among them are low fill, iso-dense bias, meniscus shape, via wall coating, and void formation. The issue focused upon in this research is incomplete displacement or void formation in the vias. These voids will have detrimental effects and could ultimately cause chip failure.

Citation Download Citation

Kelly A. Nowak "Void elimination research in bottom antireflective coatings for dual damascene photolithography", Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); https://doi.org/10.1117/12.483737

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available