Evaluation of SCAA mask technology as a pathway to the 65-nm node

James V. Beach; John S. Petersen; Mark John Maslow; David J. Gerold; Diane C. McCafferty

doi:10.1117/12.485413

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26 June 2003 Evaluation of SCAA mask technology as a pathway to the 65-nm node

James V. Beach, John S. Petersen, Mark John Maslow, David J. Gerold, Diane C. McCafferty

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Proceedings Volume 5040, Optical Microlithography XVI; (2003) https://doi.org/10.1117/12.485413
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

This study takes an integrated approach utilizing a combination of high NA 193 nm lithography, a sidewall chrome alternating aperture (SCAA) phase shift mask, optical proximity correction (OPC) and customized illumination in an attempt to demonstrate the feasibility of using 193 nm lithography to support the 65 nm node. A SCAA mask was designed and built with line/space patterns ranging in pitch from 300 nm down to 140 nm. A range of mask biases were applied to the zero and pi spaces in order to examine to response of the lithography to a combination of the SCAA approach and asymmetric biasing. In combination to the asymmetric biasing, overlay bracketing was applied in order to measure the chrome overlay tolerances of the mask. Simulations suggested that an unconventionally small sigma of 0.15 would be the optimum coherence for a high 193 nm optical system. A custom 0.15 sigma partial coherence illuminator was, therefore, built and installed in the experimental ASML Micrascan V 0.75 NA 193 nm scanner. Wafers were exposed using 190 nm of 193 nm resist and an organic BARC. The 70 nm 1:1 line/space patterns resolved with a depth of focus of about 0.2 μm. The 75 nm 1:1 line/space patterns showed a 0.3-0.4 μm depth of focus. Both of these process windows were limited by pattern collapse. Addressing the pattern collapse may improve the depth of focus. Comparing mask measurements to wafer measurements show that little or no asymmetric biasing in necessary to balance the pitch. Moreover, the measured pitch was stable over a focus range of at least 0.4 microns demonstrating that any phase imbalance present was not significantly affecting the observed lithography.

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James V. Beach, John S. Petersen, Mark John Maslow, David J. Gerold, and Diane C. McCafferty "Evaluation of SCAA mask technology as a pathway to the 65-nm node", Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); https://doi.org/10.1117/12.485413

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