Simulation of imaging and stray light effects in immersion lithography

Scott Hafeman; Andrew R. Neureuther

doi:10.1117/12.485460

26 June 2003 Simulation of imaging and stray light effects in immersion lithography

Scott Hafeman, Andrew R. Neureuther

Proceedings Volume 5040, Optical Microlithography XVI; (2003) https://doi.org/10.1117/12.485460
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

Immersion lithography is a viable method for continuing the reduction in critical dimension. Much of the improvement in image quality in immersion lithography centers around high-NA vector imaging effects and in particular the roles of the resist coupling and polarization properties. Electromagnetic scattering from local inhomogenities is considered yet emphasis is placed on the importance of accounting for high-NA, vector, immersion and resist standing wave effects. A new vector TCC formulation is introduced in SPLAT 6.0. The formulation is tested against a new theoretical formula for the Strehl ratio in air at high-NA and imaging 2D contact patterns at high NA in the resist stack.

Citation Download Citation

Scott Hafeman and Andrew R. Neureuther "Simulation of imaging and stray light effects in immersion lithography", Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); https://doi.org/10.1117/12.485460

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available