OPC methods to improve image slope and process window

Nicolas B. Cobb; Yuri Granik

doi:10.1117/12.515190

10 July 2003 OPC methods to improve image slope and process window

Nicolas B. Cobb, Yuri Granik

Proceedings Volume 5042, Design and Process Integration for Microelectronic Manufacturing; (2003) https://doi.org/10.1117/12.515190
Event: Advanced Microelectronic Manufacturing, 2003, Santa Clara, CA, United States

Abstract

In this paper, we use the gradient of the image slope and gradient of the edge placement error (EPE) in order to improve both slope and EPE during OPC. The EPE gradient taken with respect to edge position is normally called MEEF or more generally, the MEEF matrix. Use of the gradient of image slope with respect to change in edge position is a relatively new concept, introduced by Granik as the “contrast matrix”. Whereas traditional OPC techniques focus on EPE alone (pattern fidelity), we broaden the scope of OPC to maximize slope for improved image robustness and to maximize process window.

Citation Download Citation

Nicolas B. Cobb and Yuri Granik "OPC methods to improve image slope and process window", Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); https://doi.org/10.1117/12.515190

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