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22 July 2003 In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering
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Abstract
While solder joints of integrated circuits in BGA and uBGA packages can be tested with 3D-computed tomography, this process is time consuming and too expensive for anything but samples or small production volumes. This paper explores approaches to facilitate a 2D-imaging testing system for BGA and uBGA solder joints. Non-standard pad geometries can be used to cause a deformation of the solder balls during soldering; this deformation is detectable in a 2D-image. By integrating a compact X-Ray-source/detector unit into a reflow soldering station, controlling the quality of the solder joints in real-time during soldering will become possible. This information can then be fed back into the soldering station in order to optimize the soldering process.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Oliver Scholz, Michael Eisenbarth, Randolf Hanke, Thomas Bigl, and Peter Schmitt "In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering", Proc. SPIE 5045, Testing, Reliability, and Application of Micro- and Nano-Material Systems, (22 July 2003); https://doi.org/10.1117/12.484664
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