Ultralow-power operational amplifier CMOS chip for monolithic integration with neural microprobes

Chuang Zhang; Tinghui Xin; Ashok Srivastava; Pratul K. Ajmera

doi:10.1117/12.483573

22 July 2003 Ultralow-power operational amplifier CMOS chip for monolithic integration with neural microprobes

Chuang Zhang, Tinghui Xin, Ashok Srivastava, Pratul K. Ajmera

Proceedings Volume 5055, Smart Structures and Materials 2003: Smart Electronics, MEMS, BioMEMS, and Nanotechnology; (2003) https://doi.org/10.1117/12.483573
Event: Smart Structures and Materials, 2003, San Diego, California, United States

Abstract

A CMOS test chip has been designed and fabricated which can monolithically integrate ultra low-power operational amplifiers with neural microprobes through post-IC processing. Neural microprobes of varying widths (70 μm, 60 μm, 50 μm, and 40 μm) are designed with varying center-to-center spacing (195 μm, 175 μm, 165 μm, 155 μm, 145 μm, and 125 μm) on a test chip for integration. Neural microprobes are first fabricated on a separate Si substrate to develop a fabrication process for post-IC processing for integration. The amplifier is designed in standard 1.5 μm CMOS process for operation at ∓ 0.4 V. Low power performance is realized by combining forward biased source-substrate junction MOSFETs with a novel low-voltage level-shift current mirror. The designed amplifier gives a gain of 7000 (77 dB) and a 3-dB bandwidth of 30 kHz. The amplifier output has a positive offset of only 20 μV and power dissipation of only 40 μW.

Citation Download Citation

Chuang Zhang, Tinghui Xin, Ashok Srivastava, and Pratul K. Ajmera "Ultralow-power operational amplifier CMOS chip for monolithic integration with neural microprobes", Proc. SPIE 5055, Smart Structures and Materials 2003: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (22 July 2003); https://doi.org/10.1117/12.483573

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