Contact angle measurements on polysilicon for surface micromachining applications

Enakshi Bhattacharya; U. Venu Babu; L. Helen Anitha Rani; P. Pradeep; Parimi Ramaseshagiri Rao; Kunchinadka Narayana Hari Bhat

doi:10.1117/12.514520

14 October 2003 Contact angle measurements on polysilicon for surface micromachining applications

Enakshi Bhattacharya, U. Venu Babu, L. Helen Anitha Rani, P. Pradeep, Parimi Ramaseshagiri Rao, Kunchinadka Narayana Hari Bhat

Author Affiliations +

Proceedings Volume 5062, Smart Materials, Structures, and Systems; (2003) https://doi.org/10.1117/12.514520
Event: Smart Materials, Structures, and Systems, 2002, Bangalore, India

Abstract

Polysilicon layers deposited by Low Pressure Chemical Vapour Deposition (LPCVD) on sacrificial oxides are used for surface micromachined structures. Stiction is a major problem in surface micromachining both during processing and in use. Contact angle measurements on surfaces can give indication on the adhesivitiy of the surface. In this paper, contact angle measurements on polysilicon surface after different treatments are reported with a view to understand their stiction behavior. We also report on surface roughness measurements on these samples.

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Enakshi Bhattacharya, U. Venu Babu, L. Helen Anitha Rani, P. Pradeep, Parimi Ramaseshagiri Rao, and Kunchinadka Narayana Hari Bhat "Contact angle measurements on polysilicon for surface micromachining applications", Proc. SPIE 5062, Smart Materials, Structures, and Systems, (14 October 2003); https://doi.org/10.1117/12.514520

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