Paper
14 October 2003 Synchrotron radiation microlithography and etching (SMILE) for MEMS fabrication
Susumu Sugiyama
Author Affiliations +
Proceedings Volume 5062, Smart Materials, Structures, and Systems; (2003) https://doi.org/10.1117/12.514373
Event: Smart Materials, Structures, and Systems, 2002, Bangalore, India
Abstract
With the established technique of LIGA process, fabrication of three dimensional structure in micron and submicron order has become feasible. High aspect ratio microstructure technology (HARMST) have been studied uisng synchrotron radiation microlithography and etching (SMILE). Plane-pattern to cross-section transfer (PCT) technique, has been applied for forming of three-dimensional microstructures with novel shapes using deep X-ray lithography. On the other hand, a new approach of three-dimensional (3-D) micromachining without using any masks is proposed. This approach is a direct writing using synchrotron radiation (SR) etching. A few results of 3-D micromachining of PTFE using SR etching in vacuum and under an atmospheric pressure of He are also demonstrated.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Susumu Sugiyama "Synchrotron radiation microlithography and etching (SMILE) for MEMS fabrication", Proc. SPIE 5062, Smart Materials, Structures, and Systems, (14 October 2003); https://doi.org/10.1117/12.514373
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Cited by 4 scholarly publications.
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KEYWORDS
Polymethylmethacrylate

X-rays

Etching

X-ray lithography

Nickel

Photomasks

Silicon carbide

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