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10 October 2003 State of the art in large-format IR FPA development at CMC Electronics, Cincinnati
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Abstract
Last year, CMC reported performance data on the first article large format Indium Antimonide (InSb) Focal Plane Arrays (FPAs) produced at CMC Electronics Cincinnati (CMCEC). CMCEC's FPA design contains novel, thermally matched elements, which allow scaling from 256 x 256 pixel FPAs up to and including 1Kx1K and 2Kx2K FPAs as shown in Figure 1. Since a common process and wafer size is used to fabricate 256 x 256 640 x 512, 1Kx1K and 2Kx2K FPAs, the main issue in providing 2Kx2K FPAs is one of yeild improvement, not invention. Approximately 30 of these large format 1Kx1K and 2Kx2K FPAs have been built and 18 have been integrated into deliverable systems over the last year.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark E. Greiner, Mike Davis, John W. Devitt, Rich Rawe, David R. Wade, and Jeff Voelker "State of the art in large-format IR FPA development at CMC Electronics, Cincinnati", Proc. SPIE 5074, Infrared Technology and Applications XXIX, (10 October 2003); https://doi.org/10.1117/12.487644
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