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12 September 2003 1024 x 1024 large-format resistive array (LFRA) design, fabrication, and system development status
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Resistive emitter-based IRSP technology still leads the industry in terms of a flickerless, high dynamic range test solution. Santa Barbara Infrared (SBIR) is producing a high performance 1024 x 1024 Large Format Resistive emitter Array (LFRA) for use in the next generation of IR Scene Projectors (IRSPs). The CMOS Read-In Integrated Circuit (RIIC) was designed by SBIR and Indigo Systems, and fabricated at AMI Semiconductor. Performance and features include > 700 K MWIR maximum apparent temperature, 5 ms radiance rise time (10-90%), 200 Hz full frame update, and 400 Hz window mode operation. Ten 8” CMOS wafers have been fabricated and preliminarily characterized. Emitter pixel design is underway and emitter fabrication is scheduled to start at Microelectronics Center of North Carolina Research & Development Institute (MCNC-RDI) in mid-2003. This paper discusses the RIIC design, wafer probe test results, emitter pixel design, emitter fabrication plans, packaging and test plans, and reports on 1024 x 1024 IRSP system component development status.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul Tristan Bryant, Jim Oleson, Brian Lindberg, Kevin Sparkman, Stephen W. McHugh, and Steve L. Solomon "1024 x 1024 large-format resistive array (LFRA) design, fabrication, and system development status", Proc. SPIE 5092, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII, (12 September 2003);

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