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24 April 2003 A novel method for the measurement of the residual stress of surface-micromachined structures for MEMS
Jong-Hoon Kim, Jeong-Gil Kim, Soon-Chang Yeon, Jun-Hee Hahn, Ho-Young Lee, Yong-Hyup Kim
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Proceedings Volume 5116, Smart Sensors, Actuators, and MEMS; (2003) https://doi.org/10.1117/12.504384
Event: Microtechnologies for the New Millennium 2003, 2003, Maspalomas, Gran Canaria, Canary Islands, Spain
Abstract
A simple, easy-to-use and reliable method called nano-bending method is proposed to measure the residual stresses of surface-micromachined structures for MEMS (Micro-Electro-Mechanical Systems). The basic concept is based on the fact that the linear bending stiffness of the surface-micromachined bridge is affected by the residual stress of the consisting materials. It is preferentially necessary to know anchor stiffness and bending stiffness of the surface-micromachined cantilevers in the stress free state which are composed of the same materials as the surface-micromachined bridges. The usefulness of the method was demonstrated by poly-silicon surface-micromachined structures under various residual stresses. The results indicated that the measured residual stress of the as-deposited poly-silicon film is 142.70 MPa with standard deviation of 3.5 percent and the compressive residual stress decreases as growing the annealing effect.
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Jong-Hoon Kim, Jeong-Gil Kim, Soon-Chang Yeon, Jun-Hee Hahn, Ho-Young Lee, and Yong-Hyup Kim "A novel method for the measurement of the residual stress of surface-micromachined structures for MEMS", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); https://doi.org/10.1117/12.504384
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KEYWORDS
Microelectromechanical systems
Bridges
Actuators
Annealing
Molecular bridges
Smart sensors
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