Application of microscopic interferometry techniques in the MEMS field

Alain Bosseboeuf; Sylvain Petitgrand

doi:10.1117/12.500134

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3 October 2003 Application of microscopic interferometry techniques in the MEMS field

Alain Bosseboeuf, Sylvain Petitgrand

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Proceedings Volume 5145, Microsystems Engineering: Metrology and Inspection III; (2003) https://doi.org/10.1117/12.500134
Event: Optical Metrology, 2003, Munich, Germany

Abstract

Microscopic homodyne interferometry with monochromatic or white light illumination is up to now the most widely used technique for micromechanical devices and MEMS surface profiling. In the last five years its capabilities have been largely extended and this technique can now be applied to out-of-plane or in-plane vibration measurements, to micromechanical testing, to transparent film thickness mapping and to surface spectral reflectivity mapping. In this paper we will review the performances and limits of this technique and its various applications in the MEMS field from technology assessment up to final device characterization. Some guidelines are provided to achieve high frequency vibration measurements, transient response measurements as well as on wafer or in vacuum measurements. Finally, future developments needed are discussed.

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Alain Bosseboeuf and Sylvain Petitgrand "Application of microscopic interferometry techniques in the MEMS field", Proc. SPIE 5145, Microsystems Engineering: Metrology and Inspection III, (3 October 2003); https://doi.org/10.1117/12.500134

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