Study of subpixel image processing algorithms for MEMS  in-plane vibration measurements by stroboscopic microscopy

Adel Hafiane; Sylvain Petitgrand; Olivier Gigan; Samia Bouchafa; Alain Bosseboeuf

doi:10.1117/12.500141

3 October 2003 Study of subpixel image processing algorithms for MEMS in-plane vibration measurements by stroboscopic microscopy

Adel Hafiane, Sylvain Petitgrand, Olivier Gigan, Samia Bouchafa, Alain Bosseboeuf

Author Affiliations +

Proceedings Volume 5145, Microsystems Engineering: Metrology and Inspection III; (2003) https://doi.org/10.1117/12.500141
Event: Optical Metrology, 2003, Munich, Germany

Abstract

Several optical methods have been developed for the measurement of in-plane vibration of microscopic objects. However most of them need a scattering surface or a specific surface structuring. A low cost method which has not these limitations is optical stroboscopic microscopy combined with image processing by optical flow techniques. Previous works have shown that a nanometric sensitivity can be obtained. In this paper, we investigated several subpixel image processing methods for in-plane vibration measurements of MEMS by this technique. Emphasis was put on whole displacement field measurements and on fast algorithms able to process a large sequence of images without the need of a multi-resolution approach to get local vibration amplitudes. It is notably shown that use of spatiotemporal regularity between images is an efficient way to reduce noise and that a resolution in the 0.01 - 0.03 pixel range can be achieved. Results are applied to in-plane vibration local measurements in two perpendicular directions at video rate as well as to full-field mapping of in-plane vibration mode of electrostatically actuated MEMS devices in SOI technology.

Citation Download Citation

Adel Hafiane, Sylvain Petitgrand, Olivier Gigan, Samia Bouchafa, and Alain Bosseboeuf "Study of subpixel image processing algorithms for MEMS in-plane vibration measurements by stroboscopic microscopy", Proc. SPIE 5145, Microsystems Engineering: Metrology and Inspection III, (3 October 2003); https://doi.org/10.1117/12.500141

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