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14 November 2003 High-quality microcutting in silicon by advanced laser technology
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Proceedings Volume 5147, ALT'02 International Conference on Advanced Laser Technologies; (2003) https://doi.org/10.1117/12.543736
Event: ALT'02 International Conference on Advanced laser Technologies, 2002, Adelboden, Switzerland
Abstract
This paper reports on the potentialities of innovative lasers in microcutting of silicon, one of the most important materials in the field of microelectronics. In recent years, novel laser based micromachining methods have played an increasingly important role in the ongoing miniaturization of consumer electronics. Here, high-quality microcutting in silicon using a "green" laser, whose wavelength is readily absorbed by silicon, is presented.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
E. Gallus and Paolo Castelli "High-quality microcutting in silicon by advanced laser technology", Proc. SPIE 5147, ALT'02 International Conference on Advanced Laser Technologies, (14 November 2003); https://doi.org/10.1117/12.543736
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