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12 January 2004 Hybrid CMOS focal plane array with extended UV and NIR response for space applications
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Silicon-based hybrid CMOS focal plane array technology offers many advantages needed for both ground-based and space imaging applications. These advantages include enhanced UV and NIR sensitivity, extensive on-chip readout capability, inherent radiation hardness, flexible imaging readout and the ability to provide extremely low noise at high video rates. For infrared imaging applications that involve UV-through visible channels, the readout electronics commonality facilitates a great simplification to system designs. In this paper, Rockwell Scientific CMOS-based hybrid silicon FPA technology and the recent progress are presented. The hybrid FPAs developed include 640x480, 1024x1024 and 2048x2048 formats with pixel sizes ranging from 27μm to 18μm square, featuring a high optical fill factor (~100%), broad-band response (200nm to 1000nm) with high quantum efficiency, and low read noise (<6e-) that approaches astronomy CCDs at 100KHz video rate and surpasses astronomy CCDs at 1MHz rate. Other performance parameters, such as spatial uniformity, dark current, pixel crosstalk/MTF and CMOS features are also discussed.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yibin Bai, Steve G. Bernd, Joseph R. Hosack, Mark C. Farris, John T. Montroy, and Jagmohan Bajaj "Hybrid CMOS focal plane array with extended UV and NIR response for space applications", Proc. SPIE 5167, Focal Plane Arrays for Space Telescopes, (12 January 2004);


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