Paper
17 December 2003 Mask cost and specification
Author Affiliations +
Abstract
At the panel discussion of Photomask Japan 2003, we discussed about Mask cost and specification. The topics are (1) Mask price trend and its impact, (2) How to reduce the mask costs; solutions from a mask shop, mask writing tool and mask inspection tool 3) Partnering mask suppliers with mask users; reasonable mask specification and OPC strategies. The choice of DUV laser writer instead of e-beam writer is one solution for reduction of mask cost. The continuous improvement of e-beam writer and resist sensitivity for high throughput is another solution. The partnership between designer, EDA vender, mask maker and wafer lithographer becomes more important.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hisashi Watanabe and Iwao Higashikawa "Mask cost and specification", Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); https://doi.org/10.1117/12.537878
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photomasks

Optical proximity correction

Inspection

Lithography

Deep ultraviolet

Manufacturing

Binary data

RELATED CONTENT

Cost-effective strategies for ASIC masks
Proceedings of SPIE (July 02 2003)
Manufacturability of a 0.18-um OPC technology
Proceedings of SPIE (August 25 1999)
Designing to win in sub-90nm mask production
Proceedings of SPIE (November 07 2005)
PMJ' 99 panel discussion review OPC mask technology for...
Proceedings of SPIE (December 30 1999)
Mask strategy at International SEMATECH
Proceedings of SPIE (August 16 2002)

Back to Top