Paper
25 September 2003 Stress analysis for the field near crack tip of bi-material beam by image distinction of the Isodyne pattern
Yi Fu, Xinhua Ji, Yuwen Qin
Author Affiliations +
Proceedings Volume 5286, Third International Symposium on Multispectral Image Processing and Pattern Recognition; (2003) https://doi.org/10.1117/12.538988
Event: Third International Symposium on Multispectral Image Processing and Pattern Recognition, 2003, Beijing, China
Abstract
Interfacial Fracture Mechanics is the problem which attracted researchers all over the world as the strength of the composite structure are depended on the mechanical behavior of the interfacial fracture. In the paper, the stress field and stress intensity factor of a bi-material beam with crack is obtained by model with initial carrier fringes. In order to obtaining phase value of which is related to the stresses, the Fourier Transform method and frequency shift are applied. It is shown that, using this method, the research of interfacial crack can be more simple, efficient and highly accurate. This technique is very significance for the local three-dimensional effects in dynamic problems of interfacial fracture mechanics.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi Fu, Xinhua Ji, and Yuwen Qin "Stress analysis for the field near crack tip of bi-material beam by image distinction of the Isodyne pattern", Proc. SPIE 5286, Third International Symposium on Multispectral Image Processing and Pattern Recognition, (25 September 2003); https://doi.org/10.1117/12.538988
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KEYWORDS
Fourier transforms

Interfaces

Mechanics

Stress analysis

3D image processing

Composites

Fringe analysis

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