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7 June 2004 LBNL four-side buttable CCD package development
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Abstract
We have developed a precision, 4-side buttable CCD package for 2kx2k and 2kx4k format devices with minimal mechanical stress on the CCD, excellent thermal properties, reliable electrical connectivity, and shim-free mounting. We report on the package design, assembly and quality assurance procedures, measurements of packaged device flatness and flatness excursions when cooled from room temperature to 140 K, package performance and plans for future development.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hakeem M. Oluseyi, John H. Bercovitz, Armin Karcher, Christopher D. Hernikl, Tom Miller, Michela Uslenghi, Natalie Roe, Chris Bebek, Stephen E. Holland, and Michael E. Levi "LBNL four-side buttable CCD package development", Proc. SPIE 5301, Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications V, (7 June 2004); https://doi.org/10.1117/12.531954
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