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30 December 2003 Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch
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Proceedings Volume 5342, Micromachining and Microfabrication Process Technology IX; (2003) https://doi.org/10.1117/12.524722
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
This paper illustrates a novel MEMS technology that allows the creation of a multiple axis actuator / sensor trough deep silicon etching and wafer bonding techniques. As example a dual axis rotational high-stroke MEMS actuator is presented. This device can integrate a mirror to realize a device used, for example, in fully optical multiplexer. Microfabrication technology derives from our previous works and it’s based on deep silicon trench techniques as well as on wafer bonding capabilities. More over the resulting assembly after the wafer bonding is machined to proceed on realizing the complete MEMS device.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marco Del Sarto, Simone Sassolini, Mauro Marchi, and Lorenzo Baldo "Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); https://doi.org/10.1117/12.524722
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