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23 December 2003 Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror
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Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.524872
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
Special micro scanning mirrors have been designed for the investigation of torsional stress in micro-scale hinges made of crystalline silicon. The setup with precise logging of resonant frequency and deflection amplitude of the MEMS-scanners is described. First results on fatigue and fracture strength are presented. Fracture of torsion beams with 6.6 μm x 30 μm cross-section occurred at 2.0 GPa to 2.4 GPa. No sign of fatigue was observed in operation for 512 h at 1.4 GPa torsional stress in resonance at 2260.7 Hz oscillation frequency. Measured frequency variation was 0.06% without any trend.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander Wolter, Harald Schenk, Hilmar Korth, and Hubert Lakner "Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); https://doi.org/10.1117/12.524872
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